- Manufacturer：
-
- CUI Devices (2)
- Ohmite (2)
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
86
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
54
In-stock
|