- Manufacturer：
-
- Aavid (7)
- Comair Rotron (1)
- CUI Devices (1)
- Ohmite (16)
- Wakefield-Vette (4)
- Part Status：
-
- Material：
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- Packaging：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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29 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | TO-263 HEAT SINK AN... |
569
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1,476
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1,476
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1,250
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
17,202
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
17,202
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
17,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
8,246
In-stock
|