Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Image Part Manufacturer Description Stock Action
HS05 Apex Microtechnology
HEATSINK 8P TO-3 15...
5,000
In-stock
125410 Wakefield-Vette
5.50X36" EXTRUSION 1...
18
In-stock
125409 Wakefield-Vette
5.50X12" EXTRUSION 1...
5,000
In-stock
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