- Manufacturer：
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- Ohmite (2)
- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Electronic Components | HEATSINK CPU W/AD... |
697
In-stock
|
|||
|
|
Ohmite | HEATSINK DUAL FO... |
51
In-stock
|
|||
|
|
Ohmite | HEATSINK DUAL FO... |
23
In-stock
|