Series:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
ATS-PCB1051 Advanced Thermal Solutions, Inc.
HEATSINK 12-SIP W/...
5,000
In-stock
7-335-000-BA CTS Electronic Components
HEATSINK HORZ .520...
5,000
In-stock
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