- Manufacturer：
-
- Aavid (8)
- Comair Rotron (3)
- CUI Devices (3)
- Part Status：
-
- Packaging：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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23 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 25... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 19... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK STAMP 25... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 76.2X25.4X0... |
5,000
In-stock
|
|||
|
|
Aavid | TOP MOUNT HEATSI... |
622
In-stock
|
|||
|
|
Aavid | THM,10594B-TT REV BB... |
1,806
In-stock
|
|||
|
|
t-Global Technology | PH3 76.2X25.4X0.21MM |
5
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 101.6X25.4X... |
20
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 101.6X25.4X... |
5
In-stock
|
|||
|
|
t-Global Technology | PH3N NANO 76.2X25.4X0... |
35
In-stock
|
|||
|
|
t-Global Technology | PH3 101.6X25.4X0.21MM |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
3,915
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
879
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
750
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 19.3... |
393
In-stock
|
|||
|
|
Aavid | HEATSINK COPPER ... |
2,343
In-stock
|