Manufacturer:
Series:
Package Cooled:
Attachment Method:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Stock Action
HSS-B20-0508H-01 CUI Devices
HEATSINK TO-220 7.4W...
5,000
In-stock
E3A-T220-25E Ohmite
BLACK ANODIZED H...
173
In-stock
1 / 1 Page, 2 Records