- Manufacturer：
-
- Aavid (2)
- Comair Rotron (1)
- CUI Devices (1)
- Wakefield-Vette (1)
- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 22... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM BL... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|