- Manufacturer:
-
- CUI Devices (1)
- Material:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
3 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
755
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
794
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
7,556
In-stock
|