- Material：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
5,000
In-stock
|