- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Apex Microtechnology | HEATSINK 10P DIP |
5,000
In-stock
|
|||
|
|
Apex Microtechnology | HEATSINK 12P PWR S... |
22
In-stock
|
|||
|
|
Apex Microtechnology | HEATSINK 8P TO-3 1.... |
2
In-stock
|
|||
|
|
Apex Microtechnology | HEATSINK 8P TO-3 1.... |
109
In-stock
|
|||
|
|
Apex Microtechnology | HEATSINK 8P TO-3 .9... |
15
In-stock
|