- Manufacturer:
-
- CUI Devices (1)
- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
2 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEATSINK TO-220 2.9W... |
5,048
In-stock
|
|||
![]() |
Adafruit Industries | MINI ALUMINUM HE... |
336
In-stock
|