- Manufacturer：
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- CUI Devices (1)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
13
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X12.5M... |
84
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
321
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
333
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
103
In-stock
|