- Manufacturer：
-
- Aavid (9)
- CUI Devices (12)
- Ohmite (24)
- Wakefield-Vette (14)
- Material：
-
- Width：
-
- Diameter：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
68 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-268 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
5,000
In-stock
|
|||
|
|
Ohmite | TO-268 HEAT SINK /P... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 W/S... |
5,000
In-stock
|
|||
|
|
Aavid | HEATSINK TO-5 .5" B... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK ALUM NA... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
5,000
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
219
In-stock
|
|||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
287
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
367
In-stock
|
|||
|
|
Ohmite | TO-263 HEAT SINK / P... |
367
In-stock
|