- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4W ... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
2,973
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1,405
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
864
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
999
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.7W... |
964
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
900
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4.6W... |
327
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 5.1W... |
696
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
813
In-stock
|