- Series:
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- Material:
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- Type:
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- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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6 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK 100PQFP C... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK 100PQFP C... |
2,528
In-stock
|
|||
![]() |
Wakefield-Vette | HEAT SINK BGA/PGA... |
10,827
In-stock
|