- Manufacturer：
-
- Aavid (44)
- DFRobot (1)
- Panasonic (1)
- Sanyo Denki (2)
- Seeed (12)
- TE Connectivity (11)
- Trenz Electronic (5)
- Wakefield-Vette (1)
- Series：
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- Part Status：
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- Material：
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- Shape：
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- Width：
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- Diameter：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Filter：
118 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | CUSTOM MAXIFLOW ... |
5
In-stock
|
|||
|
|
Seeed | BLACK WARRIOR IC... |
5,000
In-stock
|
|||
|
|
Trenz Electronic | HEATSINK FOR TE06... |
5,000
In-stock
|
|||
|
|
Seeed | ICE TOWER CPU COO... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | TRANS THERMAL LI... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 21MM... |
5,000
In-stock
|
|||
|
|
Delta Electronics | FAN CPU COOLER 100... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 23MM... |
5,000
In-stock
|
|||
|
|
Molex Corporation | CHIPSET COOLER C... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | THERMAL LINKPRES... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 37.5M... |
5,000
In-stock
|
|||
|
|
TE Connectivity | HEAT SINK BGA 29MM... |
5,000
In-stock
|
|||
|
|
Aavid | HEATSINK |
5,000
In-stock
|
|||
|
|
Panasonic | HEAT SINK |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK APC 723 |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK APC 723 |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK APC 723 |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK CUSTOM |
5,000
In-stock
|