- Manufacturer：
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- CUI Devices (4)
- Ohmite (3)
- Wakefield-Vette (2)
- Part Status：
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- Material：
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- Width：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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12 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK BLACK A... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO220 W/C... |
235
In-stock
|
|||
|
|
Ohmite | HEATSINK AND CLI... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK 18X50MM 2-... |
436
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
134
In-stock
|
|||
|
|
Ohmite | HEATSINK AND CLI... |
58
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
170
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
794
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
7,556
In-stock
|