- Manufacturer:
-
- CUI Devices (4)
- Ohmite (13)
- Wakefield-Vette (9)
- Part Status:
-
- Material:
-
- Width:
-
- Package Cooled:
-
- Attachment Method:
-
- Height Off Base (Height of Fin):
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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31 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
Ohmite | HEATSINK BLACK A... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK TO-247 TO... |
48
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK TO247 W/C... |
239
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK TO220 W/C... |
235
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK TO126 W/C... |
250
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK TO-247 TO... |
432
In-stock
|
|||
![]() |
Ohmite | ALUMINUM HEATSIN... |
8
In-stock
|
|||
![]() |
Ohmite | ALUMINUM HEATSIN... |
5,000
In-stock
|
|||
![]() |
Ohmite | ALUMINUM HEATSIN... |
5,000
In-stock
|
|||
![]() |
Ohmite | HEATSINK AND CLI... |
5,000
In-stock
|
|||
![]() |
Ohmite | ALUMINUM HEATSIN... |
137
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK TO-220/TO... |
2,074
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK 18X50MM 2-... |
436
In-stock
|
|||
![]() |
Ohmite | HEATSINK FOR TO-2... |
752
In-stock
|
|||
![]() |
Ohmite | HEATSINK FOR TO-2... |
275
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK 18X50MM T... |
706
In-stock
|
|||
![]() |
Wakefield-Vette | HEATSINK TO-247 TO... |
463
In-stock
|