- Manufacturer：
-
- Aavid (2)
- Comair Rotron (1)
- CUI Devices (1)
- Part Status：
-
- Type：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Comair Rotron | HEATSINK STAMP 25... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
8,246
In-stock
|