- Manufacturer:
-
- Aavid (1)
- CUI Devices (3)
- DFRobot (1)
- Material:
-
- Width:
-
- Package Cooled:
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- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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7 Records
Image | Part | Manufacturer | Description | Stock | Action | |
---|---|---|---|---|---|---|
![]() |
CUI Devices | HEATSINK TO-220 2.7W... |
1,514
In-stock
|
|||
![]() |
DFRobot | RASPBERRY PI COP... |
5,000
In-stock
|
|||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-126 BL... |
453
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 2.6W... |
582
In-stock
|
|||
![]() |
CUI Devices | HEATSINK TO-220 2.6W... |
755
In-stock
|
|||
![]() |
Assmann WSW Components | HEATSINK TO-126 13.2... |
4,080
In-stock
|
|||
![]() |
Aavid | HEATSINK TO-126 VE... |
13,779
In-stock
|