- Manufacturer：
-
- CUI Devices (6)
- Ohmite (8)
- Width：
-
- Package Cooled：
-
- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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24 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
5,000
In-stock
|
|||
|
|
Ohmite | ALUMINUM HEATSIN... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,906
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,917
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,918
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,908
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,827
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,883
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,735
In-stock
|
|||
|
|
Ohmite | ALUMINUM HEATSIN... |
1
In-stock
|
|||
|
|
Ohmite | ALUMINUM HEATSIN... |
6
In-stock
|
|||
|
|
Ohmite | ALUMINUM HEATSIN... |
6
In-stock
|
|||
|
|
Ohmite | ALUMINUM HEATSIN... |
6
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,352
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,811
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1,536
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK CPU XCU... |
84
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
51
In-stock
|