- Shape：
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- Package Cooled：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
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|
|
CTS Electronic Components | HEATSINK FORGED ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK CAP .500"H... |
5,000
In-stock
|