- Manufacturer：
-
- Aavid (11)
- Comair Rotron (1)
- CUI Devices (8)
- Ohmite (2)
- Wakefield-Vette (2)
- Part Status：
-
- Material：
-
- Width：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
30 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Comair Rotron | HEATSINK EXTRUD ... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK DUAL VE... |
5,000
In-stock
|
|||
|
|
Wakefield-Vette | HEATSINK TO-220 VE... |
5,000
In-stock
|
|||
|
|
CTS Electronic Components | HEATSINK DUAL VE... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
5,000
In-stock
|
|||
|
|
CUI Devices | HEATSINK TO-220 4W ... |
5,000
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 H=1... |
5,000
In-stock
|
|||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000
In-stock
|
|||
|
|
Ohmite | HEATSINK FOR TO-2... |
100
In-stock
|
|||
|
|
Aavid | HEATSINK TO-220 BL... |
862
In-stock
|
|||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
342
In-stock
|