- Manufacturer：
-
- Molex Corporation (34)
- Amphenol ICC (11)
- AVX Corporation (2)
- C&K (19)
- GCT (7)
- JAE Electronics (25)
- KYOCERA Corporation (15)
- TE Connectivity (11)
- Series：
-
- Mounting Type：
-
- Features：
-
- Height Above Board：
-
- Connector Type：
-
- Contact Finish：
-
- Contact Finish Thickness：
-
- Card Type：
-
- Mounting Feature：
-
- Insertion, Removal Method：
-
125 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Amphenol ICC | CONN SMART CARD P... |
5,000
In-stock
|
|||
|
|
Amphenol ICC | CONN SMART CARD P... |
5,000
In-stock
|
|||
|
|
Molex Corporation | CONN SIM CARD PUS... |
5,000
In-stock
|
|||
|
|
Molex Corporation | CONN SIM CARD PUS... |
5,000
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
2,307
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
2,307
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
2,100
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
7,137
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
7,137
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
6,900
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
5,000
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
5,000
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SIM CARD PUS... |
5,000
In-stock
|
|||
|
|
Molex Corporation | CONN MICRO SIMM P... |
1,629
In-stock
|
|||
|
|
Molex Corporation | CONN MICRO SIMM P... |
1,629
In-stock
|
|||
|
|
Molex Corporation | CONN MICRO SIMM P... |
1,600
In-stock
|
|||
|
|
Molex Corporation | CONN MICRO SD CAR... |
14,112
In-stock
|
|||
|
|
Molex Corporation | CONN MICRO SD CAR... |
14,112
In-stock
|
|||
|
|
Molex Corporation | CONN MICRO SD CAR... |
13,600
In-stock
|
|||
|
|
Molex Corporation | CONN SIM CARD PUS... |
3,532
In-stock
|