- Manufacturer：
-
- Maxim Integrated (3)
- 3M (1)
- Amphenol ICC (6)
- C&K (3)
- JAE Electronics (5)
- TE Connectivity (12)
- Würth Elektronik (8)
- Series：
-
- Mounting Type：
-
- Features：
-
- Height Above Board：
-
- Connector Type：
-
- Number of Positions：
-
- Contact Finish：
-
- Contact Finish Thickness：
-
- Card Type：
-
- Mounting Feature：
-
- Insertion, Removal Method：
-
60 Records
| Image | Part | Manufacturer | Description | Stock | Action | |
|---|---|---|---|---|---|---|
|
Würth Elektronik | CONN COMPACT FLA... |
5,000
In-stock
|
|||
|
|
Würth Elektronik | CONN COMPACT FLA... |
5,000
In-stock
|
|||
|
|
3M | CONN COMPACT FLA... |
5,000
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SD CARD PUSH... |
5,000
In-stock
|
|||
|
|
KYOCERA Corporation | CONN SD CARD PUSH... |
5,000
In-stock
|
|||
|
|
JAE Electronics | CONN SIM CARD HIN... |
5,000
In-stock
|
|||
|
|
JAE Electronics | CONN SIM CARD HIN... |
5,000
In-stock
|
|||
|
|
JAE Electronics | CONN SIM CARD HIN... |
5,000
In-stock
|
|||
|
|
Hirose Electric Co Ltd | CONN MICRO SD CAR... |
5,000
In-stock
|
|||
|
|
- | CONN SIM CARD PUS... |
5,000
In-stock
|
|||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
|||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
|||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
|||
|
|
ITT Interconnect Solutions | CONN COMPACT FLA... |
5,000
In-stock
|
|||
|
|
Molex Corporation | MSD/MSIM COMBO 2.1... |
22
In-stock
|
|||
|
|
Molex Corporation | MSD/MSIM COMBO 2.1... |
22
In-stock
|
|||
|
|
Molex Corporation | MSD/MSIM COMBO 2.1... |
5,000
In-stock
|
|||
|
|
JAE Electronics | CONN MICRO SIM CA... |
5,000
In-stock
|
|||
|
|
JAE Electronics | CONN MICRO SIM CA... |
5,000
In-stock
|
|||
|
|
TE Connectivity | CONN SIM CARD PUS... |
5,000
In-stock
|